View MAX2335ETI_1272784.PDF datasheet online --- IC-ON-LINE

Datasheet File OCR Text:

19-0492; Rev 0; 10/05
KIT ATION EVALU E AILABL AV
450MHz CDMA/OFDM LNA/Mixer
General Description
The MAX2335 RF front-end receiver IC is designed for CDMA and OFDM applications in the 450MHz band. The MAX2335 includes a low-noise amplifier (LNA) with adjustable IIP3 to minimize desensitization due to crossmodulation in the presence of a large interfering signal. The mixer features differential IF outputs and is designed for high linearity and low noise, which is well suited for CDMA and OFDM applications. An on-chip frequency divider is included to allow the use of a standard 1GHz VCO. Alternatively, the divider can be bypassed for use with a lower-frequency VCO. The MAX2335 is available in a 28-pin TQFN package with exposed paddle and is specified for the -40C to +85C extended temperature range. The device is also offered in a lead-free package.
PART MAX2335ETI MAX2335ETI+
Features
1.5dB LNA Noise Figure 16dB LNA Gain 2.1dB Cascaded Noise Figure Adjustable LNA IIP3 LO Output Buffer for Transmitter LO Frequency Divider Small 5mm x 5mm, 28-Pin (Lead-Free) TQFN Package
MAX2335
Ordering Information
TEMP RANGE -40C to +85C -40C to +85C PIN-PACKAGE 28 Thin QFN-EP* (5mm x 5mm) 28 Thin QFN-EP* (5mm x 5mm) PKG CODE T2855-3 T2855+3
*EP = Exposed paddle. +Denotes lead-free package.
Applications
IF_CDMA+ IF_CDMARBIAS
Pin Configuration/ Functional Diagram
TOP VIEW
BUFFEN N.C. VCC 16 VCC 15 14 N.C. LO_OUT I.C. N.C. LO_IN LO/2 N.C. 13 12 11 /2 EP N.C. 27 LNAOUT 28 + 1 DEGEN 2 RLNA 3 GND 4 LNAIN 5 MODEO 6 MODE1 7 MODE2 9 8 10
450MHz-Band, WCDMA, IS-95, IS-2000, OFDM, Wireless Data Links
21 MIXIN 22 I.C. 23 N.C. 24 N.C. 25 VCC 26
20
19
18
17
MAX2335
THIN QFN 5mm x 5mm ________________________________________________________________ Maxim Integrated Products 1
For pricing, delivery, and ordering information, please contact Maxim/Dallas Direct! at 1-888-629-4642, or visit Maxim's website at www.maxim-ic.com.
450MHz CDMA/OFDM LNA/Mixer MAX2335
ABSOLUTE MAXIMUM RATINGS
VCC to GND ...........................................................-0.3V to +4.3V All Other Pins to GND.................................-0.3V to (VCC + 0.3V) AC Input Pins (LNAIN, LO_IN, MIXIN) to GND ...............1V Peak Continuous Power Dissipation (TA = +70C) 28-Pin Thin QFN (derate 34.5mW/C above +70C) ...........2.7W Operating Temperature Range ...........................-40C to +85C Junction Temperature ......................................................+150C Storage Temperature Range .............................-65C to +150C Lead Temperature (soldering, 10s) .................................+300C
Stresses beyond those listed under "Absolute Maximum Ratings" may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. CAUTION! ESD SENSITIVE DEVICE
DC ELECTRICAL CHARACTERISTICS
(VCC = +2.9V to +3.3V, RBIAS = 18k, RLNA = 24k, BUFFEN = LOW, LO/2 = HIGH, TA = -40C to +85C, unless otherwise noted. Typical values are at VCC = +2.9V, LOW = 0V, HIGH = +3.0V, TA = +25C, unless otherwise noted.) (Note 1)
PARAMETER Operating Supply Current Shutdown Supply Current LO Buffer Supply Current Digital Input-Logic High Digital Input-Logic Low Digital Input Current (Logic-High) Digital Input Current (Logic-Low) SYMBOL ICC ICC ICC VIH VIL IIH IIL -25 CONDITIONS HGHL mode (MODE[2:0] = 111) HGLL mode (MODE[2:0] = 101) LG mode (MODE[2:0] = 011) Shutdown mode (MODE[2:0] = 000) Addition for BUFFEN = HIGH 2 0.6 5 MIN TYP 32 24 27 0.2 7 MAX 38 29 31 10 13 A mA V V A A mA UNITS
AC ELECTRICAL CHARACTERISTICS
(MAX2335 EV Kit, VCC = +2.9V to +3.3V, fLNAIN = fMIXIN = 465MHz, fIF = 110MHz, fLO = 2 x (fMIXIN + fIF), 50 system impedance, RBIAS = 18k, RLNA = 24k, cascaded performance includes 2dB interstage filter loss, TA = -40C to +85C, unless otherwise noted. Typical values are at VCC = +2.9V, PLO_IN = -7dBm, LOW = 0V, HIGH = +3.0V, TA = +25C, unless otherwise noted.)
PARAMETER OVERALL PERFORMANCE RF Frequency Range LO Frequency Range IF Frequency Range LO Input Power LO Buffer Output Power Return Loss CASCADED PERFORMANCE HIGH-GAIN, HIGH-LINEARITY MODE (MODE[2:0] = 111) Gain Noise Figure Input Third-Order Intercept Point G NF IIP3 (Note 1) Including off-chip matching, TA = +25C (Note 2) TA = +25C (Notes 1, 3) -14 23.0 27 2.2 -11.5 31.5 2.6 dB dB dBm fRF fLO fIF (Note 2) BUFFEN = HIGH All modes, all active ports, including 2-element matching network, if necessary -7 -10 After optional LO/2 420 to 470 500 to 660 80 to 190 -3 -6 10 0 MHz MHz MHz dBm dBm dB SYMBOL CONDITIONS MIN TYP MAX UNITS
2
_______________________________________________________________________________________
450MHz CDMA/OFDM LNA/Mixer
AC ELECTRICAL CHARACTERISTICS (continued)
(MAX2335 EV Kit, VCC = +2.9V to +3.3V, fLNAIN = fMIXIN = 465MHz, fIF = 110MHz, fLO = 2 x (fMIXIN + fIF), 50 system impedance, RBIAS = 18k, RLNA = 24k, cascaded performance includes 2dB interstage filter loss, TA = -40C to +85C, unless otherwise noted. Typical values are at VCC = +2.9V, PLO_IN = -7dBm, LOW = 0V, HIGH = +3.0V, TA = +25C, unless otherwise noted.)
PARAMETER Gain Noise Figure Input Third-Order Intercept Point LOW-GAIN MODE (MODE[2:0] = 011) Gain Noise Figure Input Third-Order Intercept Point LNA PERFORMANCE HIGH-GAIN, HIGH-LINEARITY MODE (MODE[2:0] = 111) Gain Noise Figure Input Third-Order Intercept Point Gain Noise Figure Input Third-Order Intercept Point Gain Noise Figure Input Third-Order Intercept Point MIXER PERFORMANCE HIGH-GAIN, HIGH-LINEARITY MODE (MODE[2:0] = 111) Gain Noise Figure Input Third-Order Intercept Point Gain Noise Figure Input Third-Order Intercept Point Gain Noise Figure Input Third-Order Intercept Point GMIXER NFMIXER Including off-chip matching IIP3MIXER (Note 3) GMIXER NFMIXER Including off-chip matching IIP3MIXER (Note 3) GMIXER NFMIXER Including off-chip matching IIP3MIXER (Note 3) 14 7 +2 13.5 6.7 0 14 7 +2 dB dB dBm dB dB dBm dB dB dBm GLNA NFLNA IIP3LNA GLNA NFLNA IIP3LNA GLNA NFLNA IIP3LNA Including off-chip matching (Note 3) Including off-chip matching (Note 3) Including off-chip matching (Note 3) 15.5 1.7 +7 14.5 1.5 +5 -2.7 5.5 +14 dB dB dBm dB dB dBm dB dB dBm G NF IIP3 (Note 1) Including off-chip matching, TA = +25C (Note 2) TA = +25C (Notes 1, 3) 3 5 9 12 7 14 15 dB dB dBm SYMBOL G NF IIP3 (Note 1) Including off-chip matching, TA = +25C (Note 2) TA = +25C (Notes 1, 3) -15 CONDITIONS MIN 21.0 TYP 26.5 2.1 -12.5 MAX 30.5 2.5 UNITS dB dB dBm
MAX2335
HIGH-GAIN, LOW-LINEARITY MODE (MODE[2:0] = 101)
HIGH-GAIN, LOW-LINEARITY MODE (MODE[2:0] = 101)
LOW-GAIN MODE (MODE[2:0] = 011)
HIGH-GAIN, LOW-LINEARITY MODE (MODE[2:0] = 101)
LOW-GAIN MODE (MODE[2:0] = 011)
Note 1: Specifications at TA = +25C and +85C are guaranteed by production test. Specifications at TA = -40C are guaranteed by design and characterization. Note 2: Guaranteed by design and characterization. Note 3: Two-tone IIP3 tested at fRF1 = 465.9MHz and fRF2 = 466.7MHz at -25dBm/tone.
_______________________________________________________________________________________
3
450MHz CDMA/OFDM LNA/Mixer MAX2335
Typical Operating Characteristics
(MAX2335 EV Kit, VCC = +2.9V, fLNAIN = 465MHz, fIF = 110MHz, fLO_IN = 1150MHz, PLO_IN = -7dBm, RBIAS = 18k, RLNA = 24k, TA = +25C, unless otherwise noted.)
SUPPLY CURRENT (HGHL) vs. TEMPERATURE
MAX2335 toc01
LNA GAIN VS RF FREQUENCY
MAX2335 toc02
LNA NOISE FIGURE vs. RF FREQUENCY
MAX2335 toc03
34
20 16 12 LNA GAIN (dB) 8 4 0 LG -4 HG
6
SUPPLY CURRENT (mA)
LNA NOISE FIGURE (dB)
32
4
LG
30
2
28
HG
26 -40 -15 10 35 60 85 TEMPERATURE (C)
-8 400 420 440 460 480 500 RF FREQUENCY (MHz)
0 400 420 440 460 480 500 RF FREQUENCY (MHz)
LNA HGHL IIP3 vs. TEMPERATURE
MAX2335 toc04
MIXER HGHL IIP3 vs. TEMPERATURE
MAX2335 toc05
10
4 3 MIXER HGHL IIP3 (dBm) 2 1 0 -1 -2 RBIAS = 18k
9 LNA HGHL IIP3 (dBm) RLNA = 18k 8 RLNA = 24k
7
RBIAS = 24k
6
5 -40 -15 10 35 60 85 TEMPERATURE (C)
-40
-15
10
35
60
85
TEMPERATURE (C)
MIXER HG NOISE FIGURE vs. RF FREQUENCY
MAX2335 toc06
MIXER IF PORT DIFFERENTIAL PORT IMPEDANCE
MAX2335 toc07
7.0
20 EQUIVALENT PARALLEL RESISTANCE (k)
2.0 EQUIVALENT PARALLEL CAPACITANCE (pF)
MIXER HG NOISE FIGURE (dB)
15 CAPACITANCE 10
1.5
6.8
1.0
6.6
5 RESISTANCE
0.5
6.4 400 420 440 460 480 500 RF FREQUENCY (MHz)
0 0 100 200 300 400 500 RF FREQUENCY (MHz)
0
4
_______________________________________________________________________________________
450MHz CDMA/OFDM LNA/Mixer
Pin Description
PIN 1 2 3 4 5 6 7 8, 11, 14, 18, 24, 25, 27 9 10 12, 23 13 NAME DEGEN RLNA GND LNAIN MODE0 MODE1 MODE2 N.C. LO/2 LO_IN I.C. LO_OUT DESCRIPTION LNA Degeneration. Connect a 1nH to 3nH inductor from DEGEN to ground. LNA Bias. Connect an 18k to 24k resistor from RLNA to ground. Adjust RLNA to adjust the linearity of the input LNA in the HGHL mode. Ground. Connect to PC board ground plane using low-inductance vias. RF Input. Requires a DC-blocking capacitor, which can be used as part of the matching network. Logic Input. See Table 1. Logic Input. See Table 1. Logic Input. See Table 1. No Connection. These pins are internally unconnected. Connect to the PC board ground plane. Logic Input. Drive low to disable the LO/2. Drive high to enable the LO/2. LO Input. Internally matched to 50. Requires an external DC-blocking capacitor. The LO input frequency can be internally divided by two prior to application to the mixer by driving LO/2 high. Internally Connected. Leave these pins unconnected for proper operation. LO Buffer Output. Internally matched to 50. Does not require a DC-blocking capacitor. The output frequency of the buffer is equal to the LO frequency divided by two when LO/2 is high, or the LO frequency when LO/2 is low. Power Supply. Bypass pins 16 and 26 to the PC board ground with a capacitor placed as close to the pin as possible. Do not share capacitor ground vias with other ground connections. LO Output Buffer Enable. Drive high to enable the LO output buffer. Drive low to disable the LO output buffer. Differential IF Output Port. Requires pullup inductors to VCC, which can be used as part of the matching network. Bias Resistor Connection. Connect an 18k to 24k resistor from RBIAS to ground. Adjust RBIAS to adjust the linearity of the input LNA in all modes except HGHL and the mixer in all modes. Mixer Input. Requires an external matching network LNA Output. Requires an external pullup inductor to VCC and a DC-blocking capacitor, both of which can be used as part of the matching network. Exposed-Paddle Ground Connection. Solder the exposed paddle (EP) evenly to the board's ground plane for proper operation.
MAX2335
15, 16, 26 17 19, 20 21 22 28 --
VCC BUFFEN IF_CDMA-, IF_CDMA+ RBIAS MIXIN LNAOUT EP
_______________________________________________________________________________________
5
450MHz CDMA/OFDM LNA/Mixer MAX2335
Detailed Description
Low-Noise Amplifiers (LNAs)
The MAX2335's LNA gain and linearity characteristics can be adjusted using the MODE[2:0] inputs. See Table 1 for the pin settings for various operating modes. Use high-gain, high-linearity mode (HGHL) when extra-high linearity is required for cross-modulation suppression in the presence of strong interfering signals (e.g., when the system transmitter is on). Use high-gain, low-linearity mode (HGLL) when the transmitter is off and cross-modulation is not a concern, and use low-gain mode (LG) when receiving large signals. RLNA can be adjusted to vary the current and linearity of the HGHL LNA. RBIAS adjusts the current and the linearity of the HGLL and LG LNA.
LO Output Buffer
The LO output buffer is internally matched to 50 and includes a DC-blocking capacitor. Enable the buffer by driving the BUFFEN input high; disable the buffer by driving the BUFFEN input low. The frequency of the buffer output is equal to the LO frequency if the LO/2 input is driven low, or equal to the LO frequency divided by two if LO/2 is driven high.
Applications Information
Cascaded LNA/Mixer Performance
The LNA and mixer design optimizes cascaded performance in all gain and linearity modes. In HGHL mode, both the LNA and mixer have a low noise figure, high gain, and high linearity. The LNA has high gain to minimize the noise contribution of the mixer, thus increasing the receiver's sensitivity, and the LNA has high linearity for cross-modulation suppression. The HGLL mode is used when the transmitter is off and cross-modulation is not a concern. In LG mode, the received signal is strong enough that linearity is the primary concern. The LNA gain is reduced to achieve higher system linearity.
Downconverter
The mixer requires a DC-blocking capacitor at the input and pullup inductors at the output. The DC-blocking capacitors and pullup inductors can be designed to be part of the matching circuits. See Table 1 for the MODE settings for various operating modes.
S-Parameters
The S-parameters in Tables 2, 3, and 4 can be used to design the RF matching circuits.
Table 1. Operating Modes
FUNCTION HGHL MIXER HGLL MIXER CONTROL PINS
HGHL LNA
LG LNA
MODE2
MODE1
MODE0 1 1 1 1 1 1 0 0 0
LO/1
LO/2
HGHL (LO Frequency Divided by Two) HGLL (LO Frequency Divided by Two) LG (LO Frequency Divided by Two) HGHL (LO Frequency Undivided) HGLL (LO Frequency Undivided) LG (LO Frequency Undivided) Shutdown Mode Undefined Undefined

1 1 0 1 1 0 0 1 X
1 0 1 1 0 1 0 X 1
6
_______________________________________________________________________________________
LO/2 1 1 1 0 0 0 X X X
MODES
HGLL LNA
450MHz CDMA/OFDM LNA/Mixer MAX2335
Table 2. MAX2335 LNA S-Parameters in HGHL Mode
FREQUENCY (MHz) 50 100 150 200 250 300 350 400 410 420 430 440 450 460 470 480 490 500 550 600 650 700 750 800 850 900 950 1000 S11 (dB) -0.693 -1.302 -1.957 -2.407 -2.656 -2.813 -2.959 -2.953 -2.944 -2.914 -2.876 -2.878 -2.884 -2.850 -2.828 -2.828 -2.811 -2.763 -2.628 -2.444 -2.230 -1.989 -1.733 -1.464 -1.236 -0.978 -0.889 -0.858 S11 (DEGREES) -20.000 -38.600 -54.244 -68.840 -82.550 -97.830 -112.274 -127.226 -130.500 -133.724 -136.800 -139.320 -142.833 -145.863 -149.000 -159.962 -155.360 -158.386 -174.012 169.970 153.600 137.420 121.170 104.500 87.855 73.488 53.876 36.186 S21 (dB) 22.265 21.655 20.037 18.300 16.860 15.354 14.262 12.926 12.710 12.530 12.439 12.220 12.000 11.820 11.550 11.343 11.150 11.060 10.298 9.810 9.255 9.200 9.164 9.470 9.690 10.432 10.613 11.417 S21 (DEGREES) 2.173 -41.256 -68.340 -89.560 -105.680 -120.500 -133.400 -144.921 -146.900 -149.125 -151.380 -153.900 -155.650 -158.324 -160.300 -161.928 -163.540 -165.000 -174.600 178.350 170.400 162.304 154.522 146.813 135.700 127.430 112.950 101.010 S12 (dB) -45.196 -37.836 -33.411 -31.340 -29.466 -28.422 -26.605 -25.600 -25.519 -25.062 -24.960 -24.780 -24.500 -24.465 -24.239 -24.180 -23.736 -23.568 -22.850 -21.890 -21.400 -20.375 -20.230 -19.626 -19.430 -18.654 -18.512 -17.839 S12 (DEGREES) -39.133 -83.956 -107.964 -124.383 -136.021 -147.784 -161.620 -172.633 -174.766 -177.340 -179.138 177.020 176.320 173.850 171.027 169.065 167.483 164.144 152.660 139.530 128.572 117.290 106.200 94.020 83.711 70.714 59.976 45.167 S22 (dB) -0.607 -0.532 -0.819 -1.051 -1.250 -1.420 -1.492 -1.590 -1.630 -1.628 -1.634 -1.650 -1.665 -1.667 -1.697 -1.711 -1.720 -1.718 -1.756 -1.770 -1.778 -1.776 -1.828 -1.778 -1.810 -1.860 -1.887 -2.033 S22 (DEGREES) 55.183 10.563 -11.252 -26.637 -39.640 -51.424 -63.020 -73.860 -76.200 -78.540 -80.612 -82.870 -84.900 -87.422 -89.183 -91.480 -93.335 -95.970 -107.020 -117.930 -129.730 -141.100 -152.555 -164.610 -176.805 170.521 158.326 145.377
_______________________________________________________________________________________
7
450MHz CDMA/OFDM LNA/Mixer MAX2335
Power-Supply Layout
To minimize coupling between different sections of the IC, use a star configuration, which has a large decoupling capacitor at a central VCC node. The VCC traces branch out from this node, each going to a separate VCC pin of the MAX2335. At the end of each trace is a bypass capacitor with impedance to ground less than 1 at the frequency of interest. This arrangement provides local decoupling at each VCC pin. Use at least one via per bypass capacitor for a low-inductance ground connection. Also, connect the exposed paddle to the PC board GND with multiple vias to provide the lowest inductance ground connection possible.
Matching Network Layout
The layout of a matching network can be very sensitive to parasitic circuit elements. To minimize parasitic inductance, keep all traces short and place components as close to the IC as possible. Use high-Q components for the LNA input-matching network to achieve the lowest possible noise figure. Keep the distance between the differential signal lines at the mixer outputs constant and make both lines of equal length to ensure signal balance.
Chip Information
PROCESS: SiGe
Table 3. MAX2335 Mixer Input Impedance in HGHL Mode
FREQUENCY (MHz) 400 410 420 430 440 450 460 470 480 490 500 S11 (dB) -1.2 -1.229 -1.247 -1.24 -1.24 -1.25 -1.28 -1.32 -1.33 -1.35 -1.35 S11 (DEGREES) 77.23 74.52 71.7 69.124 66.47 63.97 61.455 58.68 55.87 53.565 50.87
Table 4. MAX2335 Mixer Output Impedance (Shunt RC) in HGHL Mode
IF FREQUENCY (MHz) EQUIVALENT SHUNT RESISTANCE (k) 17.7 16.961 15.79 14.616 13.49 11.87 EQUIVALENT SHUNT CAPACITANCE (pF) 1.21 1.21 1.21 1.21 1.21 1.21
80 100 120 140 160 190
8
_______________________________________________________________________________________
450MHz CDMA/OFDM LNA/Mixer MAX2335
Typical Application Circuit
465MHz BANDPASS FILTER 3.9pF 18nH 470 0.01F 100pF LNAOUT V CC 47nH
V CC
0.01F
20
MIXIN
N.C.
N.C.
N.C.
VCC
I.C.
28 1nH 24k
27
26
25
24
23
22 21 RBIAS 18k 270nH 1k
6.8pF IF OUT+ VCC
+
MAX2335
EP
DEGEN RLNA GND
1 2 3 4 5 6 7
20 19 18
IF_CDMA+ IF_CDMAN.C. BUFFEN VCC VCC VCC LO BUFFER ENABLE
100pF 270nH 6.8pF IF OUTVCC
6800pF 22nH
LNAIN MODEO MODE1 MODE2
MODEO DUPLEXER MODE1 MODE2
/2
17 16 15
100pF
1000pF
22F
8 N.C.
9 LO/2
10 LO_IN
11 N.C.
12 I.C.
13 LO_OUT LO INPUT
14 N.C.
VCC
100pF 1GHz VCO CHARGEPUMP OUTPUT RFPLL
100pF PLL INPUT PA
MAX2370
REFERENCE INPUT 19.2MHz TCXO
_______________________________________________________________________________________
9
450MHz CDMA/OFDM LNA/Mixer MAX2335
Package Information
(The package drawing(s) in this data sheet may not reflect the most current specifications. For the latest package outline information go to www.maxim-ic.com/packages.)
D2 D D/2 MARKING k L E/2 E2/2 E (NE-1) X e
C L C L
b D2/2
0.10 M C A B
AAAAA
E2
PIN # 1 I.D.
DETAIL A
e (ND-1) X e
e/2
PIN # 1 I.D. 0.35x45 DETAIL B
e
L1
L
C L
C L
L
L
e 0.10 C A 0.08 C
e
C
A1 A3
PACKAGE OUTLINE, 16, 20, 28, 32, 40L THIN QFN, 5x5x0.8mm
-DRAWING NOT TO SCALE-
21-0140
I
1
2
10
______________________________________________________________________________________
QFN THIN.EPS
450MHz CDMA/OFDM LNA/Mixer
Package Information (continued)
(The package drawing(s) in this data sheet may not reflect the most current specifications. For the latest package outline information go to www.maxim-ic.com/packages.)
MAX2335
COMMON DIMENSIONS
PKG. 16L 5x5 20L 5x5 28L 5x5 32L 5x5 40L 5x5 SYMBOL MIN. NOM. MAX. MIN. NOM. MAX. MIN. NOM. MAX. MIN. NOM. MAX. MIN. NOM. MAX.
EXPOSED PAD VARIATIONS PKG. CODES
D2
MIN. NOM. MAX.
E2
MIN. NOM. MAX.
exceptions
L
0.15
A A1 A3 b D E e k L
0.70 0.75 0.80 0.70 0.75 0.80 0.70 0.75 0.80 0.70 0.75 0.80 0.70 0.75 0.80 0 0.02 0.05 0 0.02 0.05 0 0.02 0.05 0 0.02 0.05 0 0.02 0.05 0.20 REF. 0.20 REF. 0.20 REF. 0.20 REF. 0.20 REF. 0.25 0.30 0.35 0.25 0.30 0.35 0.20 0.25 0.30 0.20 0.25 0.30 0.15 0.20 0.25 4.90 5.00 5.10 4.90 5.00 5.10 4.90 5.00 5.10 4.90 5.00 5.10 4.90 5.00 5.10 4.90 5.00 5.10 4.90 5.00 5.10 4.90 5.00 5.10 4.90 5.00 5.10 4.90 5.00 5.10 0.50 BSC. 0.40 BSC. 0.65 BSC. 0.50 BSC. 0.80 BSC.
DOWN BONDS ALLOWED
- 0.25 0.35 0.45 0.25 - 0.25 - 0.25 - 0.25 0.30 0.40 0.50 0.45 0.55 0.65 0.45 0.55 0.65 0.30 0.40 0.50 0.40 0.50 0.60 L1 0.30 0.40 0.50 40 N 20 28 32 16 ND 10 5 7 8 4 10 5 7 8 4 NE ----WHHC WHHD-1 WHHD-2 WHHB JEDEC
NOTES: 1. DIMENSIONING & TOLERANCING CONFORM TO ASME Y14.5M-1994. 2. ALL DIMENSIONS ARE IN MILLIMETERS. ANGLES ARE IN DEGREES. 3. N IS THE TOTAL NUMBER OF TERMINALS. 4. THE TERMINAL #1 IDENTIFIER AND TERMINAL NUMBERING CONVENTION SHALL CONFORM TO JESD 95-1 SPP-012. DETAILS OF TERMINAL #1 IDENTIFIER ARE OPTIONAL, BUT MUST BE LOCATED WITHIN THE ZONE INDICATED. THE TERMINAL #1 IDENTIFIER MAY BE EITHER A MOLD OR MARKED FEATURE. 5. DIMENSION b APPLIES TO METALLIZED TERMINAL AND IS MEASURED BETWEEN 0.25 mm AND 0.30 mm FROM TERMINAL TIP.
T1655-2 3.00 T1655-3 3.00 T1655N-1 3.00 T2055-3 3.00 3.00 T2055-4 T2055-5 3.15 T2855-3 3.15 T2855-4 2.60 T2855-5 2.60 3.15 T2855-6 T2855-7 2.60 T2855-8 3.15 T2855N-1 3.15 T3255-3 3.00 T3255-4 3.00 T3255-5 3.00 T3255N-1 3.00 T4055-1 3.20
3.10 3.10 3.10 3.10 3.10 3.25 3.25 2.70 2.70 3.25 2.70 3.25 3.25 3.10 3.10 3.10 3.10 3.30
3.20 3.20 3.20 3.20 3.20 3.35 3.35 2.80 2.80 3.35 2.80 3.35 3.35 3.20 3.20 3.20 3.20 3.40
3.00 3.00 3.00 3.00 3.00 3.15 3.15 2.60 2.60 3.15 2.60 3.15 3.15 3 3.00 3 3.00 3.00 3.00 3.20
3.10 3.10 3.10 3.10 3.10 3.25 3.25 2.70 2.70 3.25 2.70 3.25 3.25 3.10 3.10 3.10 3.10 3.30
3.20 3.20 3.20 3.20 3.20 3.35 3.35 2.80 2.80 3.35 2.80 3.35 3.35 .20 .20 3.20 3.20 3.40
** ** ** ** ** 0.40 ** ** ** ** ** 0.40 ** ** ** ** ** **
YES NO NO YES NO YES YES YES NO NO YES YES NO YES NO YES NO YES
** SEE COMMON DIMENSIONS TABLE
6. ND AND NE REFER TO THE NUMBER OF TERMINALS ON EACH D AND E SIDE RESPECTIVELY. 7. DEPOPULATION IS POSSIBLE IN A SYMMETRICAL FASHION. 8. COPLANARITY APPLIES TO THE EXPOSED HEAT SINK SLUG AS WELL AS THE TERMINALS. 9. DRAWING CONFORMS TO JEDEC MO220, EXCEPT EXPOSED PAD DIMENSION FOR T2855-3 AND T2855-6. 10. WARPAGE SHALL NOT EXCEED 0.10 mm. 11. MARKING IS FOR PACKAGE ORIENTATION REFERENCE ONLY. 12. NUMBER OF LEADS SHOWN ARE FOR REFERENCE ONLY. 13. LEAD CENTERLINES TO BE AT TRUE POSITION AS DEFINED BY BASIC DIMENSION "e", 0.05.
PACKAGE OUTLINE, 16, 20, 28, 32, 40L THIN QFN, 5x5x0.8mm
-DRAWING NOT TO SCALE-
21-0140
I
2
2
Maxim cannot assume responsibility for use of any circuitry other than circuitry entirely embodied in a Maxim product. No circuit patent licenses are implied. Maxim reserves the right to change the circuitry and specifications without notice at any time.
Maxim Integrated Products, 120 San Gabriel Drive, Sunnyvale, CA 94086 408-737-7600 ____________________ 11 (c) 2005 Maxim Integrated Products Printed USA is a registered trademark of Maxim Integrated Products, Inc.

▲Up To Search▲

Price & Availability of MAX2335ETI

	To Download MAX2335ETI Datasheet File
If you can't view the Datasheet, Please click here to try to view without PDF Reader .